Method of soldering copper connection



METHOD OF SQLDERTNG COPPER C(BNNECTHUN STRIPS T (IQQLING THERMOPILE ELEC- TRODES Evgeny Andreevich Kolenho, til. Academica Pavlova, l4, Apt. 26; Andrey Georgievich Tauher, nl. Mahovaja 26, Apt. 25; and Anatoly Grigorievich Czerliina, Sapiorny per. 16, Apt. 53; all of Leningrad, USSR. No Drawing. Filed Apr. 15, 19%, Ear. No. 23,879

1 Claim. (Cl. 29-492) This invention relates to a method of soldering copper connection strips to cooling thermopile electrodes.

The existing method of joining copper connection strips to semiconductor thermopile electrodes does not instre long service of the devices because solder joining of materials (copper to electrode alloy) which posses greatly dilferent coefiicients of linear expansion results in the appearance of rnicrocracks in the joint after a short period of service of the thermopile, impairs its func tioning and leads to its premature failure.

The object of this invention is a method of soldering copper connection strips to cooling thermopiles which differs in that the electrodes are preliminarily coated with a butler layer of relatively higher melting point alloy to which the connection strips are subsequently soldered.

The method proposed herein for the joining of copper strips to thermopile electrodes is aimed towards overcoming the shortcoming stated above. In accordance with this invention, with the aid of a soldering torch or any other method a 0.2 to 0.3 mm. thick buffer layer of a relatively high melting point alloy is applied to the thermopile electrode. This alloy contains, for example,

3,997,425 Eatented July 16, 1963 99 percent of bismuth and 1 percent of tin. The buffer layer of alloy serves to take up the mechanical stresses developed in the joint owing to periodic thermal shock and precludes the appearance of microcracks. The copper connection strips are soldered to the buffer layer surface in the usual Way, solder used for this purpose, in this case, is Woods alloy or some other alloy with a melting point not over C.

What we claim is:

A method of soldering copper conductor strips to cooling thermopile electrodes comprising applying 0.2 to 0.3 mm. thick coating of an alloy of 99% bismuth and 1% tin to a thermopile electrode, then soldering a copper conductor onto the coating employing an alloy having a melting point which does not exceed 140 C.

References Cited in the file of this patent UNITED STATES PATENTS 2,289,152 Telkes July 7, 1942 2,381,819 Graves et a1 Aug. 7, 1945 2,811,571 Fritts et a1. Oct. 29, 1957 2,877,283 Justi Mar. 10, 1959 2,924,976 Barbiskin et a1 Feb. 16, 1960 2,953,617 Heikes et a1. Sept. 20, 1960 3,017,693 Haba Ian. 23, 1962 OTHER REFERENCES U.S. Bureau of Standards, Circular No. 382, April 2, 1930, pages 6, 7, and 26. 

1. A METHOD OF SOLDERING COPPER CONDUCTOR STRIPS TO COOLING THERMOPILE ELECTRODES COMPRISING APPLYING 0.2 TO 0.3 MM. THICK COATING OF AN ALLOY OF 99% BISMUTH AND 1% TIN TO A THERMOPILE ELECTRODE, THEN SOLDERING A COPPER CONDUCTOR ONTO THE COATING EMPLOYING AN ALLOY HAVING A MELTING POINT WHICH DOES NOT EXCEED 140*C. 